SHIBAURA
SHIBAURA MECHATRONICS CORPORATION
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Vacuum bonding equipment

Vacuum bonding equipment

Designed for glass substrates, wafers, OLED panels, LCD panels, optical pick-up lens, LPF for digital cameras, etc.
Bubble-free bonding of glass substrates by uniform spin coating of adhesives and bonding in vacuum chamber

Features

  • Bubble-free vacuum bonding
  • With UV curing
  • Supports various substrate shapes and films
  • Conditions of Spin, UV curing and bonding can be set to assure uniform film thickness after bonding
Substrate
to be handled
Thickness 0.05mm to 2.0mm
Size Circular: Φ28mm to Φ200mm
Rectangular:□22mm to □140mm
Ultimate Pressure 5Pa
Equipment Dimensions 1400W × 1000D × 1800H












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