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BHCU-12P-7511 Vacuum Coating Equipment for Semiconductors and Electronic Components

BHCU-12P-7511 Vacuum Coating Equipment for Semiconductors and Electronic Components

High vacuum coating equipment developed for thick film formation in semiconductor manufacturing

Features

  • Thick film formation
    Forms a thick film of 10 to 30µm by switching eight pairs of resistance heating evaporation sources
  • High efficiency vacuum coating
    Achieves film forming efficiency of 34% with tri-axial rotating film-forming method (planetary dome type) and our simulation technology (film forming efficiency = mass of film/charge amount)
  • Space saving
    Compact design reduces footprint to 70% that of our previous product
    Minimizes use of clean room space by separating the front door (operation panel) with partition.
Vacuum characteristics Ultimate pressure 2×10-5 Pa or less
Exhaust time Within 18min to 4×10-4 Pa
Outgas release 4×10-6 Pa•m3/s
Production capacity
(Throughput)
Planetary dome × 3
4" silicon wafer 42 wafers/batch (14 wafers/dome×3 domes)
5" silicon wafer 24 wafers/batch (8 wafers/dome×3 domes)
6" silicon wafer 18 wafers/batch (6 wafers/dome×3 domes)
Evaporating
characteristics
Film thickness distribution Within ±5%
Evaporating source Resistance heating evaporating source: 8 units
Evaporator power supply 10V 1000A

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