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CCS-1401/1601 Low Temperature Multi-Layer Sputtering Equipment

CCS-1401/1601 Low Temperature Multi-Layer Sputtering Equipment

Best suited to form back face electrodes on discrete devices

Features

  • Applicable to lapping wafer (t 100µm)
  • Can set up to seven different types of target metal
  • Fully automated cassette to cassette transfer
  • Color TFT touch panel display for easy operation
  • CUP-GUN achieves less damage in oxidation film removal
  • Supports ferromagnetic targets
  • Simultaneous sputtering (with additional DC power supply)
  • For forming oxidation film
Equipment CCS-1401 CCS-1601
Sputtering method Magnetron down sputtering
Wafer size 5in (4in) 6in (5in)
Sputtering source Model P-GUN125RD (Φ5in×2) ×7
Sputtering power supply DC: 6kW×2 (6kW×4)
Ion etching RF: 1kW×1
Main pump Cryo pump
Coating uniformity ≤±10% ≤±10%
Ultimate pressure (S/C) 8×10-5 Pa






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