SHIBAURA
SHIBAURA MECHATRONICS CORPORATION
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BM-600 High-Speed, Single-Wafer Sputtering Equipment

BM-600 High-Speed, Single-Wafer Sputtering Equipment

Multi-purpose, single-wafer sputtering equipment based on the single-wafer sputtering technology nurtured in developing sputtering equipment for discs.
This equipment is best suited for single layer sputtering for automobile mirrors, vanity mirrors, glass master discs and electronic components.

Features

  • Single-wafer load lock sputtering equipment
  • Realizes high throughput by minimum capacity load lock
  • Supports various sized substrates, up to Φ250×20h
  • Equipped with an automatic substrate carrier mechanism
  • Quick target replacement owing to indirect cooled sputtering source with large size of Φ300
  • Forms highly uniform film
  • Space saving small main unit with a footprint of 0.8×0.9m
  • High speed starting time turbo molecular pump
Exhaust system Turbo molecular pump
Sputtering
characteristics
Substrate dimensions Φ250×20D (max.)
Film thickness distribution Within 5% (within Φ200)
Sputtering source Φ300 magnetron sputtering source (DC 20kW)
Target Cr, Al, Ag, Au, Ni, Ti, etc
Tact time 6sec/wafer (for Cr film with 50nm thickness)
Carrier system Swing arm type (automatic)


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