SHIBAURA
SHIBAURA MECHATRONICS CORPORATION
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SYSTEM Series Double-Sided Sputtering Equipment

SYSTEM Series Double-Sided Sputtering Equipment

Single-wafer automatic mass production type sputtering equipment achieves simultaneous sputtering on both sides of a wafer.
Processing chamber can be extended to handle large size substrate.
System upgrades available on customer request

Features

  • High productivity by simultaneous double-sided film forming
  • Easy extension of processing chamber
  • Improved maintainability
  • Full consideration for safety
Effective sputtering area 300mm × 600mm
Cycle time 1 piece / min (Double-side)
Ultimate pressure 7 x 10-5 Pa
Equipment dimensions 4800W × 2000D × 2600H














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