Single-wafer automatic mass production type sputtering equipment achieves simultaneous sputtering on both sides of a wafer.
Processing chamber can be extended to handle large size substrate.
System upgrades available on customer request
|Effective sputtering area||300mm × 600mm|
|Cycle time||1 piece / min (Double-side)|
|Ultimate pressure||7 x 10-5 Pa|
|Equipment dimensions||4800W × 2000D × 2600H|