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CFS-4ES/i-Miller Sputtering Equipment for Research and Development

CFS-4ES/i-Miller Sputtering Equipment for Research and Development

Load lock type and batch process type sputtering equipment with high-level specifications and wide variety of options.
These two types of sputtering equipment can be used for R&D and for multi-product production.

Features

  • Sputtering source achieves uniform film thickness distribution over a wide area. (±5% (SiO2) in 170mm diameter)
  • Affordable price for high-level specifications and range of options
  • Forms film at both high and low temperatures
  • Design concept of easy operation and maintenance
  • Clean side sputtering and load lock chamber
  • Space saving, compact equipment
  CFS-4EP-LL<i-miller> CFS-4ES-231
L / L type Batch type
Sputtering
method
Side sputtering Side sputtering
Sputtering
source
Φ3in×3 (4) Φ3in×3
Holder size Φ200 Φ200
Ultimate
pressure
5×10-4 Pa (2×10-5 Pa) 5×10-4 Pa
Exhausting time
(10min)
7×10-3 Pa 7×10-3 Pa
Exhausting
operation
Auto (full automatic) Manual
Sputtering
operation
Manual (full automatic) Manual
Power
supply
RF500W (DC1kW) RF500W (DC1kW)
Temperature 300°C 300°C
Etching
power source
RF500W RF500W
Size 1250W×811D×1528H 950W×860D×1540H

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