SHIBAURA
SHIBAURA MECHATRONICS CORPORATION

Technical Topics

Ultrasonic bonding by flip chip bonder

1. What is Ultrasonic Bonding?

The bonding method applies ultrasonic vibration to the chip.

2. Line up of Ultrasonic Horns

Ultrasonic horns for small pin and for multiple pins are available.

Ultrasonic horn for multiple pins

 

Ultrasonic horn for small pin

 


3. Example of Ultrasonic Bonding

Photo of ultrasonic bonding of COF for LCD driver using the ultrasonic horn for multiple pins

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