SHIBAURA
SHIBAURA MECHATRONICS CORPORATION

TFC-900 Flip Chip Bonder

TFC-900 Flip Chip Bonder

Flip chip bonder for 300mm wafer, suitable for high-speed bonding of small chips

Features

  • High productivity
    Mounting tact time: 1.0 sec/point (precision of ±15µm) or 1.2 sec/point (precision of ±10µm)
  • High reliability
    Fine bonding load control: 1 to 20N
  • Supports various processes
    Options provide support for various processes
    Soldering process, NCP, ultrasonic process, etc.
  • Various options, applicable to multi-chip mounting automatic tray feeding and flux transfer dipping
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