SHIBAURA
SHIBAURA MECHATRONICS CORPORATION
Home > Products > Semiconductor Manufacturing Equipment > Chemical Dry Etching Equipment

CDE-80N Chemical Dry Etching Equipment

CDE-80N Chemical Dry Etching Equipment

Performs chemical dry etching of thin film on a semiconductor wafer in gaseous state (dry). Damage-free etching process through perfect separation of the etching unit and plasma generating unit enables wide use in the damage removal process.

Features

  • Microwave-based chemical dry etching
  • Wafer temperature control
  • Applicable to 8-inch wafers
  • Enables rear face etching
  • Transfer by double finger type robot
Equipment specifications
Etching method Microwave-utilized chemical dry etching
Etching material Poly-Si, Si3N4,BPSG, W, Mo, Ta etc
Wafer size Φ8"(OptionΦ6", Φ5")
Etching chamber Single wafer
Vacuum pump Dry pump
Pressure control Conductance valve control
Etching gas CF4, O2, N2 etc
Plasma power supply Microwave 2. 45GHz 1. 0kW

Page Top